Parker Chomerics CHO-FORM 5575 is a silver plated aluminum filled electrically conductive form-in-place gasket. It is specifically designed to provide excellent conductivity and EMI shielding for electronics enclosures in high temperature applications. Its quick curing silicone system and flow properties make it perfect for dispensing on small complex part geometries in high volume manufacturing applications.
Parker Chomerics silver plated aluminum filler delivers superior galvanic corrosion resistance on aluminum substrates which may eliminate the need for additional plating or secondary environmental gaskets.
Features and Benefits:
• One component
• Use in environments up to 125° C (257 °F)
• Silver plated aluminum filler
• Moisture cure silicone
• Easy to use and apply. No weighing or mixing required
• Excellent conductivity, 0.005 ohm-cm
• Outstanding galvanic corrosion resistance against aluminum substrates
• Minimize application costs, good for high volume projects
Typical Applications:
• Densely populated electronics packaging
• PCB inter-compartmental isolation with thin wall boundaries
• Castings, machined metal, and conductive plastic enclosures
• Transportation/Automotive sensor housing
• Military and Aerospace electronics
• Telecom
• Life Science
