Parker Chomerics CHO-FORM® family of conductive form-in-place gasket materials are ideal for densely populated electronics packaging, especially where intercompartmental isolation is required. The form-in-place characteristics mean that CHO-FORM® can be used in rapid prototyping applications on substrates such as castings, machined metal, conductive plastic housings, and at board level. Parker Chomerics CHO-FORM® 5538 form-in-place EMI gasket is a one-component, moisture cure silicone system capable of small bead size applications while providing greater than 65 dB shielding effectiveness and good galvanic corrosion resistance with mated aluminum surfaces. CHO-FORM® 5538 consists of a Ni/Graphite particle filler and utilizes an enhanced moisture cure technology which requires ONLY 4 hours at 50% relative humidity for complete cure. It can be dispensed in the smallest bead size of any Chomerics form-in-place material with bead size dimensions of 0.015 x 0.020 inches. Features and Benefits:• Up to 60% reduced installation cost and nominal cost for production scale-up• Up to 60% space savings within enclosures (gasketing available for flanges as narrow as 0.025 in)• Excellent adhesion to common housing substrates (4-12 N/cm adhesion) • Highly compressible gaskets, ideal for low closure force housings• Quick turn-around of prototypes and samplesParker Chomerics Capabilities:• Fully programmable 3 axis application technology • Tight dimensional control and bead termination (0.001-inch tolerance of bead size)• Automated dimensional verification of gasket bead placement using optical measuring technologyTypical Applications:• Densely populated electronics packaging• PCB inter-compartmental isolation with thin wall boundaries• Castings, machined metal, and conductive plastic enclosures• Transportation/Automotive sensor housing• Military and Aerospace electronics• Telecom• Life Science
