Parker Chomerics CHO-FORM® family of conductive form-in-place gasket materials are ideal for densely populated electronics packaging, especially where intercompartmental isolation is required. The form-in-place characteristics mean that CHO-FORM® can be used in rapid prototyping applications on substrates such as castings, machined metal, conductive plastic housings, and at board level. Parker Chomerics CHO-FORM® 5513 form-in-place EMI gasket is a two-component, thermal cure silicone system providing greater than 70 dB shielding effectiveness and excellent adhesion to chromate coated aluminum surfaces. CHO-FORM® 5513 consists of a Ag/Cu particle filler and utilizes a thermal cure technology which allows for a minimal cure cycle of only 30 minutes at 140°C. Features and Benefits:• Up to 60% reduced installation cost and nominal cost for production scale-up• Up to 60% space savings within enclosures (gasketing available for flanges as narrow as 0.025 in)• Excellent adhesion to common housing substrates (4-12 N/cm adhesion) • Highly compressible gaskets, ideal for low closure force housings• Quick turn-around of prototypes and samplesParker Chomerics Capabilities:• Fully programmable 3 axis application technology • Tight dimensional control and bead termination (0.001-inch tolerance of bead size)• Automated dimensional verification of gasket bead placement using optical measuring technologyTypical Applications:• Densely populated electronics packaging• PCB inter-compartmental isolation with thin wall boundaries• Castings, machined metal, and conductive plastic enclosures• Transportation/Automotive sensor housing• Military and Aerospace electronics• Telecom• Life Science
