THERM-A-GAP Gels T635 Dispensable, Very Low Compression Force, Thermal Gap Fillers | Product Series

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THERM-A-GAP Gels T635 Dispensable, Very Low Compression Force, Thermal Gap Fillers

THERM-A-GAP Gels T635 Dispensable, Very Low Compression Force, Thermal Gap Fillers

Parker Chomerics THERM-A-GAP™ Gel T635 is a highly conformable, pre-cured, single-component compound with 1.7 W/m-K Thermal Conductivity.

Especificaciones técnicas

  • Color: White
  • Caudal: 8 cc/min
  • Gravedad específica: 1.5
  • Deflexión a presión: n/a
  • Grosor de la película: 0.38 mm
  • Conductividad térmica: 1.7 W/m-K
  • Capacidad de calefacción: 0.9 J/g-K
  • Coeficiente de expansión térmica: 400 ppm/K
  • Temperatura de funcionamiento: -67 to 392 °F
  • Resistencia dieléctrica: 200 VAC/mil
  • Resistividad volumétrica: 10^14 ohm-cm
  • Constante dieléctrica: 4 @ 1 MHZ
  • Factor de disipación: 0.003 @ 1 MHZ
  • Cumplimiento con especificaciones: UL 94 V-0, RoHS
  • Pérdida de masa total de desgasificación: Not Tested
  • Vida útil en depósito: 18 Months

Descripción completa del producto

Parker Chomerics THERM-A-GAP™ T635 gel is a highly conformable, pre-cured, single-component compound with 0.7 W/m-K thermal conductivity. The cross-linked gel structure provides superior long term thermal stability and reliable performance. These unique materials result in much lower mechanical stress on delicate components than even the softest gap-filling sheets. They are ideal for filling variable gaps between multiple components and a common heat sink.

Features / Benefits:
• Dispensable
• Fully cured
• Highly conformable at low pressures
• No refrigeration, mixing or filler settling issues in storage
• Single dispensable TIM can eliminate multiple pad part sizes/numbers
• Reworkable

Product Attributes:
• Excellent thermal performance
• Low deflection force required
• Minimal stress on components

Typical Applications:
• Automotive electronic control units (ECUs)
• Engine control
• Transmission control
• Braking/traction control
• Power conversion equipment
• Power supplies and uninterruptible power supplies
• Power semiconductors
• MOSFET arrays with common heat sinks
• Televisions and consumer electronics

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