Parker Chomerics THERM-A-GAP GEL 20 is a moderate performance, one component, dispensable thermal interface material with 2.4 W/m-K thermal conductivity developed to conduct heat from electronics to a heat sink or enclosure.
The material’s heavy paste-like consistency enables controlled dispensing, applied in variable thicknesses to suit application needs. THERM-A-GAP GEL 20 requires low compressive force to deform under assembly pressure subjecting components, solder joints and leads to minimal stresses.
It is formulated to accommodate today’s high reliability requirements for thermal cycling & high temperature environments.
Features and Benefits:
• Thermal conductivity: 2.4 W/m-K
• Low compression force
• Excellent consistency and long term reliability
• Low oil bleeding
• Resists movement under vibration
• Superior Tackiness
Product Attributes:
• Provides low thermal impedance at thin and thick gaps
• Accommodates variety of bond line thicknesses
• Compatible with high volume, automated dispense equipment
• Proven reliability in extreme temperature cycling and shock & vibration
• Deflects easily under low compressive forces, decreasing stress on components and therefore decreasing component failure
Typical Applications:
• Automotive electronic control units (ECUs)
• Converter & Inverter & OBC
• ADAS control Module
• Vehicle Infotainment
• Power Supplies & Semiconductors
• Memory & Power Modules
• Microprocessors / Graphics Processors
• Flat Panel Displays & Consumer Electronics
