Thermally Conductive Liquid Dispensed Gap Fillers

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Thermally Conductive Liquid Dispensed Gap Fillers

Thermally Conductive Liquid Dispensed Gap Fillers

Our liquid-dispense, cure-in-place gap fillers combine high thermal conductivity and low viscosity to dissipate heat from high powered electric vehicle components.

CoolTherm® SC-1200 thermally conductive silicone gap filler is a two-component system designed to provide excellent thermal conductivity for electronic applications, while retaining desirable properties associated with silicones.
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CoolTherm® SC-3500 thermally conductive, low volatile silicone gap filler is a two-component system designed to provide excellent thermal conductivity for electronic applications, while retaining desirable properties associated with silicones.
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CoolTherm® SC-6754 grease is a one-component silicone material used to provide a thermal path between semiconductors and heat sinks by displacing the air gap between the mating surfaces. It is also used as a non-curing, shock resistant sealant.
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CoolTherm® TC-404 thermally conductive grease is a non-reactive, solvent-free silicone material designed for applications where a highly conductive thermal interface material is required and where the device may later need to be easily removed.
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CoolTherm® TC-501 grease is a solvent-free silicone thermal interface material designed to replace greases used as TIMs between the heat spreader and the heat sink (commonly known as TIM2).
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CoolTherm® UR-2000 gap filler is a two-component thermally conductive urethane system designed to provide thermal conductivity for electronic applications. It cures at room temperature to produce a flame-retardant adhesive.
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CoolTherm® SC-1600 thermally conductive silicone gap filler is a two-component system designed to provide thermal conductivity for electronic applications, while retaining desirable properties associated with silicones.
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CoolTherm® SC-2000 RW (reworkable) thermally conductive, soft-curing silicone gap filler is a two-component system which provides excellent thermal conductivity for electronic applications, while retaining desirable properties of a silicone.
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CoolTherm® SC-3000 LD (Low Density) gap filler is a low density, two-component silicone system designed to provide excellent thermal conductivity for electronic applications, while retaining desirable properties associated with silicones.
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CoolTherm® SC-2000 SLW (slow) thermally conductive, soft-curing gap filler is a two-component system which provides excellent thermal conductivity for electronic applications, while retaining desirable properties associated with silicones.
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