THERM-A-GREASE 50 5.0 W/m-K High Reliability, Thin Bondline Thermal Grease | #65-02-GREASE50-0030


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65-02-GREASE50-0030

THERM-A-GREASE 50 5.0 W/m-K High Reliability, Thin Bondline Thermal Grease | #65-02-GREASE50-0030

Parker Chomerics THERM-A-GREASE 50 is a high-performance, thin bondline thermal grease engineered for the efficient dissipation of heat in electronic components.


Especificaciones técnicas

  • Volumen: 27
  • Color: White
  • Gravedad específica: 3.0
  • Viscosidad dinámica: 350,000 cP
  • Temperatura de funcionamiento: -50 to 200 °C
  • Conductividad térmica: 5.0 W/m-K
  • Impedancia térmica: 0.013 °C-cm2/W @ 40 psi, @ 0.001 in (0.025 mm) thick, 0.011 °C-cm2/W @ 100 psi, @ 0.001 in (0.025 mm) thick
  • Capacidad de calefacción: 1 J/g-K
  • Pérdida de masa total de desgasificación: 0.10 % TML
  • Cumplimiento con especificaciones: RoHS
  • Vida útil en depósito: 12 Months

Información del artículo

Parker Chomerics THERM-A-GREASE 50 is a high-performance, thin bondline thermal grease engineered for the efficient dissipation of heat in electronic components. Comprising silicone-based materials, it ensures high reliability in demanding applications.

The minimum bond line of 0.001” (0.025 mm) makes GREASE 50 ideal for applications with stringent manufacturing and assembly tolerances. It operates effectively under low pressure, making it suitable for heat transfer in delicate or densely packed PCB components.

THERM-A-GREASE 50 is rigorously tested for high reliability. It withstands thermal cycling, long-term heat aging, and high humidity conditions, ensuring stability without pumping out or hardening/cracking over time in extreme environments.

Engineered for user convenience, GREASE 50 is easily applied via stenciling, screen printing, or dispensing, and allows straightforward rework for repairs. It requires no mixing, curing, or refrigeration, simplifying both application and storage processes.

This advanced thermal grease is designed to meet the precise needs of engineers seeking dependable thermal management solutions in high-performance electronics.

Product Features
- Thin bondline: 0.001” (0.025mm)
- Require low compression force
- Can be stenciled, screen-printed, or dispensed
- High reliability

Typical Applications
- CPUs and GPUs
- Memory modules
- Power supplies
- Power conversion equipment
- Lighting applications
- Automotive control modules and electronics

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Contacto local

Latin American Group Headquarters

Parker Hannifin Ind. e Com. Ltda.

Estrada Municipal Joel de Paula, 900

São José dos Campos

SP

Brasil

12247-015

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