Parker Chomerics THERM-A-GAP™ PAD 70TP Thermally Conductive Gap Filler Pads provide a very low hardness (15 Shore 00) solution with 7.0 W/m-K of thermal conductivity.
Parker Chomerics THERM-A-GAP™ PAD 70TP is an ultra-soft, ultra-conformable high performance thermally conductive gap filler pad with 7.0 W/m-K thermal conductivity.
THERM-A-GAP PAD 70TP offers the combination of both excellent thermal conductivity and ultra-soft conformability, along with very low outgassing to provide an effective thermal interface between heat sinks and electronic devices where there are uneven surfaces, air gaps and rough surface textures may exist.
THERM-A-GAP PAD 70TP is manufactured to size and facilitates easy application on the desired component.
A fabric carrier version is available for improved tear resistance and easy handling. The product provides superior thermal performance and long term stability over conventional thermal pads.
Product Features and Benefits:
• High thermal conductivity 7.0 W/m-K
• Highly conformable, soft
• Low deflection force
• Electrically isolating
• Low oil bleeding
Typical Applications:
• Telecom Equipment
• PC board to chassis
• Thermally enhanced BGAs
• Memory packages & modules
• GPU & CPU
• Industrial Devices
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Latin American Group Headquarters
Parker Hannifin Ind. e Com. Ltda.
Estrada Municipal Joel de Paula, 900
São José dos Campos
SP
Brasil
12247-015
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