THERM-A-GAP GEL 60HF is part of the Parker Chomerics family of fully cured, one component silicone-based, dispensable thermal interface materials. With a 6.2 W/m-K thermal conductivity, it is designed for high performance heat transfer from electronics components to cooling features and meant to be used across industries and applications.

The “HF” in GEL 60HF stands for “High Flow”, indicating that the material is ideal for high volume dispensing applications and high throughput production operations. As with all Parker Chomerics thermal gels, it is optimized for automated dispensing at various packaging sizes while retaining properties for easy rework and field repair situations.

The paste-like consistency of THERM-A-GAP GEL 60HF enables very tightly controlled dispensing and accurate material placement during assembly. It requires low compressive force to deflect under assembly pressure, subjecting components, solder joints and PCB leads to minimal stress.

Features and Benefits:
• Thermal conductivity: 6.2 W/m-K
• High flow rate: 80g/min
• No secondary curing required
• Low thermal impedance
• Very low compression force
• Reworkable
• Room temperature storage

Typical Applications:
• Consumer electronics
• Telecommunications equipment
• Energy storage devices
• Power electronics and modules
• Automotive control units and sensors
• Computing components (CPUs, GPUs, memory)