THERM-A-GAP GEL 35VT Thermally Conductive Gel | #65-00-GEL35VT-0010


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65-00-GEL35VT-0010

THERM-A-GAP GEL 35VT Thermally Conductive Gel | #65-00-GEL35VT-0010

Parker Chomerics THERM-A-GAP GEL 35VT is a one-component, dispensable thermal interface gel material with 3.5 W/m-K thermal conductivity.


Especificaciones técnicas

  • Tipo de paquete: 10cc Luer-Lock™ manual syringe
  • Cumplimiento con especificaciones: UL 94 V-0, RoHS
  • Color: White
  • Caudal: 23 g/min
  • Gravedad específica: 2.9
  • Conductividad térmica: 3.5 W/m-K
  • Capacidad de calefacción: 1 J/g-K
  • Coeficiente de expansión térmica: 150 ppm/K
  • Temperatura de funcionamiento: -40 to 302 °F, -55 to 200 °C
  • Resistencia dieléctrica: 7.9 VAC/mil
  • Resistividad volumétrica: 10^13 ohm-cm
  • Constante dieléctrica: 6.8 @ 100 KHZ
  • Factor de disipación: 0.0002 @ 1 MHZ
  • Clasificación de inflamabilidad: UL 94 V-0
  • Pérdida de masa total de desgasificación: 0.135 % TML (0.0731% CVCM)
  • Vida útil en depósito: 12 Months
  • Minimum Bondline Thickness: 0.004 inch, 0.10 mm
  • Opciones de material de polímero: Silicone Rubber (VMQ, PVMQ)

Información del artículo

Parker Chomerics THERM-A-GAP GEL 35VT is a one-component, dispensable thermal interface gel material with 3.5 W/m-K thermal conductivity. It was developed to conduct heat from electronics to heat sinks or enclosures and perform reliably in vertical, high vibration, and harsh environments. The “VT” suffix in the product name stands for “vibration/vertical and tackiness” as this material was thoroughly tested during development to withstand rigorous reliability testing within vibration and vertical slump testing.

THERM-A-GAP GEL 35VT requires no mixing or secondary curing and is designed for easy application and rework. The tackiness of GEL 35VT serves the added benefit of displacing air at thin bond lines and minimizing thermal impedance. It can be dispensed at various bond line thicknesses to take up gaps created by assembly or manufacturing tolerances. As with all Parker Chomerics thermal gels, it is formulated to accommodate today’s high-performance and high reliability electronics while being ideal for automated dispensing machines and field repair situations.

Product Features
• 3.5 W/m-K Thermal Conductivity
• Vibration and pump out resistance
• Vertical slump resistance
• Cost effective
• High tackiness
• No secondary cure required
• Reworkable

Typical Applications
• Telecommunications Infrastructure
• Battery Energy Storage Systems (BESS)
• ADAS and Automotive Control Modules
• Automotive Sensors and Radar
• Power Electronics
• Consumer Electronics
• Industrial Electronic Equipment

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Latin American Group Headquarters

Parker Hannifin Ind. e Com. Ltda.

Estrada Municipal Joel de Paula, 900

São José dos Campos

SP

Brasil

12247-015

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