Parker Chomerics THERM-A-GAP™ GEL 25NS is a single component, non-silicone, dispensable gel with 2.1 W/m-K thermal conductivity. This material is ideal for any manufacturing facility that is a silicone-free environment.

THERM-A-GAP GEL 25NS has been designed to eliminate silicone contamination and provide the maximum thermal performance in devices requiring minimal thermal resistance and high component reliability.

THERM-A-GAP GEL 25NS is compatible with soldering chemicals and components can be repainted with ease and has no silicone staining or pump out. This single component product requires no mixing or curing providing superior design flexibility.

Features/Benefits:

• No silicone contamination
• Free of paint wetting impairment substances (PWIS) according to ASTMs.
• Easily dispensable
• Pre-cured / No pump out
• High bulk thermal conductivity
• Low thermal impedance
• Ultra-low compression force
• High tack surface & reworkable
• Proven long-term reliability

Typical Applications:

• Automotive electronic control units (ECUs)
• Vision control systems
• LEDs
• Power supplies
• Semiconductors
• Memory
• Power modules
• Microprocessors / graphics processors
• Flat panel displays
• Consumer electronics