Parker Chomerics CHO-BOND® 580-208 conductive adhesive is a two-component, silver-filled epoxy is designed to be thinned and applied as an ink or spray coating
Parker Chomerics CHO-BOND® 580-208 conductive adhesive is a two-component, silver-filled epoxy is designed to be thinned and applied as an ink or spray coating. CHO-BOND® 580-208 is a silver-colored epoxy meant to be thinned and applied as a uniform coating with good bonding strength to a variety of substrates Features and Benefits:• Silver filler is a premium conductivity solution to electrical bonding• Excellent conductivity levels (0.003 ohm-com)• Strong adhesion properties (>700 PSI lap shear strength)• Material can be sprayed or screen printed for bus bars• Medium paste makes it effective for easy dispensing from a small needle for small cracks and voids• Fast cure at elevated temperatures (45 minutes at 100°C) and room temperature cure options• No volatile organic compounds• 1:1 mix ratio makes measurement and application very easyTypical Applications:• Bus bars• Grounding of EMI shielding windows
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