Parker Chomerics CHO BOND® 2165 is a two-component, stabilized-copper filled sealant specifically formulated for Aerospace and Military applications
Parker Chomerics CHO BOND® 2165 is a two-component, stabilized-copper filled sealant specifically formulated for Aerospace and Military applications. CHO BOND® 2165 is a brownish-red colored polyurethane that is often used in conjunction with CHO-SHIELD® 2000 series EMI coatings to serve as a repair kit for military aircraft. Features and Benefits:• Excellent electrical conductivity (0.010 ohm-cm)• Very good corrosion resistance on aluminum substrates• Aircraft fluid resistance • Chromate free making it environmentally friendly• Thick paste can be used on overhead or vertical surfaces• Elevated temperature cure option (15 minutes at 113°C) as well as room temperature cure optionTypical Applications:• Aircraft fastener fill• Gap Filler• Aircraft repair compound
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