Parker Chomerics CHO BOND® 1121 is a one component, VOC-free, silver-plated copper filled sealant formulated to serve as gap filler for EMI shielding or electrical grounding. CHO BOND® 1121 is a gray-colored silicone that is ideally used for filling gaps but can also serve as a repair or bonding agent for elastomer gaskets where moderate strength (150 PSI lap shear strength) is required. CHO-BOND® 1121 has identical properties to CHO BOND® 1038 with the exception of VOC content and shelf life (1121 has no VOCs and 12 month shelf life).

Features and Benefits:
• One-component system so no mixing or measuring required
• Excellent electrical conductivity levels (0.010 ohm-cm)
• No corrosive by-products generated during drying
• Extended shelf life (12 months) relative to similar conductive sealants
• Medium consistency paste makes the material easy to dispense in overhead or vertical applications
• No Volatile Organic Compounds (VOC-free)
• Working time of 30 minutes and can be handled in 24 hours
• No pressure required when curing to achieve bond

Typical Applications:
• Man-portable electronics
• Radar and Communication Systems
• EMI vents
• Military Ground Vehicles
• Military Shelters