Parker Chomerics CHO-BOND® 1086 is an air-drying liquid coating used to improve the adhesion of CHO-BOND 1016, 1030, 1035, 1038, 1075 electrically conductive adhesives/sealants and CHOTHERM® 1641 thermal compound.
Parker Chomerics CHO-BOND® 1086 is an air-drying liquid coating used to improve the adhesion of Parker Chomerics CHO-BOND® conductive silicone compounds to metal and other non-silicone substrates. The primers are moisture reactive and clear in color. CHO-BOND® 1086 primer is formulated to achieve maximum adhesion on non-silicone substrates for CHO-BOND® 1016, 1030, 1035, 1038, 1075 electrically conductive adhesives/sealants and CHOTHERM® 1641 thermal compound. Features/Benefits:• Easy to apply• Clear in color• Creates secure, maximum bond• Works on a variety of substrates• Variety of packaging options available
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