Parker Chomerics CHO-BOND® 1077 is a nickel plated aluminum filled, one-component conductive silicone designed for use as a fillet, gap filler and seam sealant on electrical enclosures for EMI shielding.
Parker Chomerics CHO-BOND® 1077 is a nickel plated aluminum filled, one-component conductive silicone designed for use as a fillet, gap filler and seam sealant on electrical enclosures for EMI shielding.
The nickel aluminum filler of CHO-BOND 1077 provides excellent galvanic corrosion resistance when applied to aluminum substrates. CHO-BOND 1077 has moderate electrical conductivity but maintains stable EMI shielding in salt spray/salt fog environments. No volatile organic compounds (VOCs) and minimal shrinkage upon curing make CHO-BOND 1077 a good choice for a variety of commercial and military applications. CHO-BOND 1077’s moisture cure silicone polymer system allows it to cure to the touch within one day and provides a robust conductive and environmental seal over a wide range of application temperatures.
Features/Benefits:
• One component
• No primer required
• Easy to use, no mixing required
• Superior galvanic corrosion resistance against aluminum
• Can be used on overhead or vertical surfaces
• No VOCs
• Moisure cure silicone
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Latin American Group Headquarters
Parker Hannifin Ind. e Com. Ltda.
Estrada Municipal Joel de Paula, 900
São José dos Campos
SP
Brasil
12247-015
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