Parker Chomerics CHO-BOND 1019 is a silver-plated aluminum filled, two-component electrically conductive polythioether designed for use as a fillet, gap filler and seam sealant on electrical enclosures for EMI shielding. Its silver-plated aluminum filler provides excellent corrosion resistance and is designed for galvanic compatibility with aluminum substrates which reduces maintenance costs and increases aircraft availability with minimal downtime.

Because of this, CHO-BOND 1019 is galvanically compatible with Parker Chomerics CHO-SEAL® 1285 silver-aluminum filled silicone and CHO-SEAL 1298 silver-aluminum filled fluorosilcone gaskets.

CHO-BOND 1019’s custom formulated polythioether polymer system offers excellent fluid and fuel resistance to jet fuels, de-icing solutions, hydraulic fuels and more. It is also silicone-free, removing any silicone contamination concerns while also being easily paintable – eliminating the need and cost of an additional primer application.

CHO-BOND 1019 has been qualified on hexavalent chromium per MIL-DTL-5541 Class 1A and trivalent chromium per MIL-DTL-5541 Type II Class 3 in harsh conditions including heat, humidity, and salt fog where it maintains stable EMI shielding performance. Overcoat adhesion qualified with MIL-PRF-23377 Type II Class N and Mil-DTL-53022 Type II epoxy primers.

Product Features
• Excellent EMI shielding, conductivity and grounding
• Excellent galvanic corrosion resistance against aluminum substrates
• Silicone free, easily paintable
• Packaged in a pre-measured kit
• Lightweight
• Overhead and vertical surfaces

Typical Applications
• Ballistics and guided weaponry
• Ground/transport vehicles
• Military shelters and containers
• Planes, drones, helicopters
• Defense radar systems
• Applications where corrosion resistance is necessary combined with exposure to fuels and fluids