Parker Chomerics THERM-A-GREASE 30 is a high-performance, thin bondline thermal grease engineered for the efficient dissipation of heat in electronic components. Comprising silicone-based materials, it ensures high reliability in demanding applications.
The minimum bond line of 0.001” (0.025 mm) makes GREASE 30 ideal for applications with stringent manufacturing and assembly tolerances. It operates effectively under low pressure, making it suitable for heat transfer in delicate or densely packed PCB components.
THERM-A-GREASE 30 is rigorously tested for high reliability. It withstands thermal cycling, long-term heat aging, and high humidity conditions, ensuring stability without pumping out or hardening/cracking over time in extreme environments.
Engineered for user convenience, GREASE 30 is easily applied via stenciling, screen printing, or dispensing, and allows straightforward rework for repairs. It requires no mixing, curing, or refrigeration, simplifying both application and storage processes.
This advanced thermal grease is designed to meet the precise needs of engineers seeking dependable thermal management solutions in high-performance electronics.
Product Features
- Thin bondline: 0.001” (0.025mm)
- Require low compression force
- Can be stenciled, screen-printed, or dispensed
- High reliability
Typical Applications
- CPUs and GPUs
- Memory modules
- Power supplies
- Power conversion equipment
- Lighting applications
- Automotive control modules and electronics
