Parker Chomerics THERM-A-GAP™ Gel 8010 is a fully cured dispensable gel with a thermal conductivity of 3.0 W/m-K, designed to eliminate time consuming hand assembly, decreasing installation costs and reducing customer manufacturing and purchasing (logistical) complexity. It is specifically meant for thin bond line applications and provides superior design flexibility while requiring no mixing or curing. Features/Benefits: • Easily dispensable • Fully-cured / No pump out • High bulk thermal conductivity • Low thermal impedance • Ultra low compression force • High tack surface and reworkable • Proven long-term reliabilityProduct Attributes:• Provides low thermal impedance at thin gaps, allowing use of common heat spreaders • Proven reliability in extreme temperature cycling and shock & vibration • Deflects easily under very low compressive forces, decreasing stress on components thus decreasing component failures. • Thin bond line gel (approximately 2-10 mils) • Low thermal impedance gel • Stencil printable with no pump out • Ideal for high-volume dispensing • Proven long-term reliability Typical Applications: • Automotive electronic control units (ECUs) • Power supplies and semiconductors • Memory and power modules • Microprocessors/graphics • Processors • Flat panel displays and consumer electronics
