Parker Chomerics THERM-A-GAP™ Gel 30G s a 3.5 W-m/K, fully cured dispensable thermal interface gel with added glass beads for bondline thickness control. It requires no mixing or curing, providing superior design flexibility.

Features/Benefits:
• Same as THERM-A-GAP GEL 30, but with added glass beads for bondline thickness control
• Fully-cured / No pump out
• High bulk thermal conductivity
• Low thermal impedance
• Ultra low compression force
• High tack surface & reworkable
• Proven long-term reliability

Product Attributes:
• Provides low thermal impedance at thin and thick gaps, allowing use of common heat spreaders
• Proven reliability in extreme temperature cycling and shock & vibration
• Deflects easily under very low compressive forces, decreasing stress on components thus decreasing component failures.
• Accommodates a variety of bond line thicknesses for application to multiple devices
• Successfully used to fill a variety of different gap thickness
• Compatible with high volume, automated dispense processes
• Meets Telcordia (Bellcore) silicone specifications

Typical Applications:
• Automotive Electronic Control Units (ECU’s)
• Power Supplies & Semiconductors
• Memory & Power Modules
• Microprocessors / Graphics
• Processors
• Flat Panel Displays & Consumer Electronics