Parker Chomerics TECKNIT 8116 conductive adhesive is a two-component, silver-filled epoxy formulated to provide a strong bond and electrical pathway between mating surfaces. TECKNIT 8116 is a silver-colored epoxy that is ideal for bonding machines enclosures with tight tolerances. Features and Benefits:• Silver filler is a premium conductivity solution to electrical bonding• Superb conductivity levels (0.002 ohm-cm)• Strong adhesion properties (>1400 PSI lap shear strength)• Medium consistency paste means it can be dispensed out of needles and fill small voids/cracks• 1:1 mix ratio makes measurement and application very easy• Fast cure at elevated temperatures (30 minutes at 100°C) and room temperature cure optionsTypical Applications:• Electrical enclosure bonding• Electrical component grounding• Cold soldering• Sealing and bonding machined enclosures• Circuit repair• EMI shielding
