Parker's Rolling Seals are utilized in CMP processes to provide sealing and translate motion to the polishing head and dressing components. The CMP process requires parts to have robust design and material properties to handle demanding environments.

Material Properties:
•Resilient materials to handle high torque loads
•High purity materials
•High tensile strength
•Abrasion resistance
•Tear resistance

Lower cost of ownership:
•Increased wafer throughput
•Extended PM cycles
•Faster cycle times