CoolTherm MG-133 thermally conductive gel is a one-component, silicone interface material that exhibits the low thermal resistance properties of a grease while possessing the integrity of a gel.
CoolTherm MG-133 gel is designed to provide efficient heat transfer from flip chip microprocessors, PPGAs, BGAs, microBGAs, DSP chips, graphic accelerator chips, and other high wattage electronic components that are on ceramic substrates. CoolTherm MG-133 gel was not developed for organic substrates.
Features and Benefits:
• Thin Bondlines – achieves thin bondlines of 1-2 mils, minimizing the thermal pathway and maximizing heat flow..
• High Thermal Conductivity – provides high thermal conductivity for applications where superior heat dissipation is required.
• Low Thermal Resistance – provides minimal thermal resistance due to low viscosity and good wetting.
• High Reliability – provides excellent resistance to moisture and temperature cycling; resists pump-out and cracking.
• Reworkability – low modulus at elevated temperatures allows material to be repaired.
Shelf Life/Storage:
Shelf life is six months when stored at -30°C in original, unopened container. Syringe must be maintained at -30°C in a vertical (upright) position with the dispense tip facing down. Do not store syringe on its side (horizontally).
This material is shipped and stored frozen. Consult handling instructions for thawing.
