CHO-SHIELD 571 Electrically Conductive Silver Epoxy Paint | Product Series

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CHO-SHIELD 571 Electrically Conductive Silver Epoxy Paint

CHO-SHIELD 571 Electrically Conductive Silver Epoxy Paint

Parker Chomerics CHO-SHIELD® 571 is a highly conductive, advanced coating developed for high volume, precise spray application on circuit boards and semiconductor packages.

Especificaciones técnicas

  • Opciones de material de polímero: Epoxy
  • Material de relleno: Silver
  • Tipo de paquete: 2 Component Kit, A: 1 Pint Aluminum Can, B: 4 Fluid Ounce Amber Bottle
  • Cebado incluido: Not Required
  • Relación: 100:8.3 by weight
  • Color: Silver
  • Viscosidad de aspersión y método de prueba: 19 to 25 sec Zahn Cup 2
  • Resistividad de la superficie: <= 0.010 Ω/square
  • Nivel de blindaje de ruido: > 100 dB
  • Grosor de la película: 0.025 mm
  • Gravedad específica: 1.39
  • Temperatura de funcionamiento: -40 to 125 °C
  • Vida útil en depósito: 9 Months

Descripción completa del producto

Parker Chomerics CHO-SHIELD® 571 is a highly conductive, advanced coating developed for high volume, precise spray application on circuit boards and semiconductor packages. Combined with innovative technologies and packaging designs, CHO-SHIELD® 571 can provide board level or package level EMI shielding of electrical components.

Applied correctly, CHO-SHIELD® 571 can replace stamped metal cans, saving valuable board space and reducing the overall cost of board level EMI shielding. The polymer system has been custom formulated to closely match the coefficient of thermal expansion (CTE) of typical epoxy molding compounds resulting in great adhesion and environmental stability of the coating on semiconductor devices.

Features/Benefits:
• Two component
• Silver in color
• Designed for high volume spray application
• Minimum 12 hour working life at room temperature
• Silver flake filler
• Excellent conductivity and EMI shielding of components
• Epoxy coating
• Good adhesion to semiconductor packaging materials due to CTE (coefficient of thermal expansion) match of polymer
• Environmentally stable
• Withstands wave solder temperatures in excess of 262°C (500°F)

Typical Applications:
• Board level EMI shielding of printed circuit boards (PCBs) or other electrical components

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