CHO-BOND 1016 Nickel-Plated Graphite Filled Silicone Electrically Conductive Sealant for Corrosion Resistance | Product Series

Filtrar por

    No hay ningún filtro seleccionado

Peso (g)

Embalaje

Consiga su cuenta de Parker hoy mismo!

Cree una cuenta para gestionar todo lo que haga con Parker, desde sus preferencias de compra hasta su acceso a la aplicación.


LOADING IMAGES
CHO-BOND 1016 Nickel-Plated Graphite Filled Silicone Electrically Conductive Sealant for Corrosion Resistance

CHO-BOND 1016 Nickel-Plated Graphite Filled Silicone Electrically Conductive Sealant for Corrosion Resistance

Parker Chomerics CHO BOND® 1016 is a one-component, nickel-plated graphite filled conductive sealant formulated to provide galvanic corrosion resistance when mated with aluminum substrates

Especificaciones técnicas

  • Opciones de material de polímero: Silicone
  • Material de relleno: Nickel-plated graphite
  • Cebado incluido: 1086
  • Relación: 1-part
  • Color: Dark Gray
  • Resistividad volumétrica: 0.500 Ω-cm
  • Resistencia a la cizalla por tracción: 1034 kPa
  • Gravedad específica: 2.4
  • Durómetro: 80
  • Temperatura de funcionamiento: -55 to 125 °C
  • Horas de servicio: 0.5 Hours
  • Vida útil en depósito: 6 Months
  • Grosor de la película: 0.25 mm

Descripción completa del producto

Parker Chomerics CHO BOND® 1016 is a one-component, nickel-plated graphite filled conductive sealant formulated to provide galvanic corrosion resistance when mated with aluminum substrates. CHO BOND® 1016 is a dark gray-colored silicone that is ideally used for filling gaps but can also serve as a repair or bonding substrate for elastomer gaskets. The moisture cure mechanism means that it can cure to the touch in 24 hours and provide a resilient and environmental seal.

Features and Benefits:
• One-component system so no mixing or measuring required
• Good galvanic corrosion matching with aluminum
• Low cost solution for moderate conductivity (0.500 ohm-cm)
• No corrosive by-products generated during drying
• Minimal weight added to assembly due to lightweight material
• Medium consistency paste can be applied overhead or vertically
• No volatile organic compounds
• No pressure required when curing to achieve bond

Typical Applications:
• Man-portable electronics
• Radar and Communication Systems
• EMI vents
• Military Ground Vehicles
• Military Shelters

Documentos relacionados

×
Productos Peso (g) Embalaje
50-02-1016-0000 71 1.5 fluid ounce aluminum foil tube
50-01-1016-0000 300 6 fluid ounce SEMCO cartridge

687852
179336